Rohan Paul 转述称，Nvidia 已要求台积电成为其第四家先进存储供应商，台积电据报已开始起草 3D DRAM 芯片制造计划。目前 Nvidia 的先进存储只能从三星、SK 海力士和美光三家采购，若台积电加入则供应来源增至四家。该请求延续了 Nvidia 此前据报在 10 月提出的要求，即三家存储厂商的定制 HBM 基础裸片均采用台积电 3nm 工艺，以便在短缺时调配订单量。
Nvidia is trying to create a 4th source of advanced memory.
They have reportedly asked TSMC to become a 4th supplier of advanced memory.
And TSMC reportedly has started drafting plans to make 3D DRAM chips at Nvidia’s request.
means right now Nvidia can buy advanced memory from only 3 companies: Samsung, SK Hynix and Micron.
If TSMC starts making it too, Nvidia gets a 4th place to buy from, which means more supply and less power for the other 3 to raise prices.
The request builds on Nvidia’s reported October requirement that the 3 memory makers all use TSMC’s 3nm process for its custom HBM base dies, so Nvidia can shift order volume between them during shortages.
3D DRAM gives TSMC an opening because no incumbent has turned it into a mature product yet, and TSMC already holds its own vertical DRAM patents.
TSMC WEIGHS MAKING 3D DRAM AT NVIDIA'S REQUEST $TSM has reportedly begun drawing up plans to manufacture advanced 3D DRAM chips as AI-driven memory shortages push chip designers to seek additional supply, per The Information. Unlike conventional DRAM, 3D DRAM stacks memory cells vertically to increase density. The move could put TSMC in direct competition with Samsung, SK Hynix and Micron. No production timeline has been set. TSMC is considering building new fabs or converting an existing facility, but says its focus remains on its core logic foundry business.在 X 查看被引用的帖子
来源：Rohan Paul · x.com